Software failures value worldwide economy a calculable US$1.7 trillion in 2018, per the Software Fail Watch, a report on software failures issued annually by Austrian software testing firm. It has known 606 recorded package failures, impacting 1/2 the world’s population and 314 firms.
Software analytics researchers like prof. David Lo of the Singapore Management University (SMU) faculty of knowledge Systems will facilitate to enhance software quality and responsible faculty member Lo analyses the massive quantity of information created throughout the software lifecycle, as well as ASCII text file, bug reports and user feedback, and produces automatic solutions that facilitate to either stop or cut back the impact of software failures.
He works at the intersection of software engineering and information science. He analyses completely different styles of software artifacts, like code, execution traces, bug reports, Q&A posts and developer networks, and also the interaction among them. faculty member Lo, who discovered that he became fascinated by programming when a raid QuickBASIC as a middle school student.
Manual detection and repair software programs of their defects or bugs, known informally as “debugging”, sometimes needs serious investments in time and resources. automatic debugging solutions will dramatically improve developer productivity and system quality. “I have designed an array of automatic solutions to assist developers to manage an oversized variety of bug reports. The solutions embrace techniques to spot duplicate bug reports, prioritize bug reports, assign bug reports to appropriate developers, and find buggy files given a bug report,” faculty member Lo aforesaid. His solutions additionally embrace technologies that establish risky or buggy package changes (also called commits), mechanically repair programs, and uncover problems in the deployed packages through large-scale user feedback observation. in a very recent study, titled “Emerging app issue identification from user feedback: expertise on WeChat” and printed within the Proceedings of the 41st ACM/IEEE International Conference on package Engineering.